This document contains information on the PowerPC 604 RISC Microprocessor Hardware Specifications
This document provides advance hardware specifications for the PowerPC 604 RISC microprocessor, available from Motorola as the MPC604. It covers general parameters including technology node (0.5 µm CMOS) and package types such as C4-CQFP and BGA.
The datasheet details DC and AC electrical characteristics, power dissipation figures at various frequencies (100-133 MHz), and comprehensive timing specifications for clock inputs, system inputs, and outputs. It also includes pin assignments, package descriptions, thermal management information, and ordering codes.
| Technology | 0.5 µm CMOS, four-layer metal |
|---|---|
| Chip size | 196 mm² (12.4 mm x 15.8 mm) |
| Supply voltage | 3.3 V – 5% |
| Maximum power dissipation (100 MHz) | 24 W |
| Absolute maximum supply voltage | -0.3 to 3.6 V |
| C4-CQFP thermal resistance (junction-to-case) | 0.03 °C/W |
The maximum power dissipation is 24 W.
Available packages include Surface-mount 304-pin C4-CQFP and Surface-mount 255-lead ceramic ball grid array (BGA).
The storage temperature range is -55 to 150 °C.