This document introduces the packaging options for AMD die and wafers, including Waffle Pack, Surftape and Reel, GEL-PAK Die Tray, Wafer Jar, GEL-PAK Wafer Tray
The document provides a product carrier guide for AMD die and wafer shipments. It explains the different carrier options, their materials, dimensions, and how they are packed for safe transport.
Carrier designs covered include waffle packs, surftape‑and‑reel, GEL‑PAK die trays, wafer jars, and GEL‑PAK wafer trays. Packing steps, labeling requirements, and dimensional specifications are detailed for each carrier type.
| Surftape width (12 mm tape) | Ao 12.0 mm, Bo 2.5 mm |
|---|---|
| Reel diameter | 7 inches (178 mm) |
| Die orientation in surftape | Uniform; pin 1 oriented to top of pocket |
| Surftape tolerances | +0.1 mm unless otherwise specified |
For a 12 mm tape the critical dimensions are Ao 12.0 mm and Bo 2.5 mm, with other parameters listed in the table.
Labels include wafer run number, date code, die quantity, ordering part number, assembly lot number, and customer part number.