This is the user guide of Foxconn LIF 223 Socket User Guide, which introduces the application, outline dimension, pick & place design, recommended soldering condition, actuation introduce, unpacking guide, how to reserve socket etc.
The Foxconn LIF 223 Socket is a 223‑position low‑insertion‑force socket designed for PGA packages. It offers a compact envelope (50.34 mm × 21.94 mm × 2.24 mm) and precise alignment features for reliable mounting.
This manual covers application guidance, mechanical dimensions, pick‑and‑place design, recommended lead‑free soldering profile, step‑by‑step actuation instructions, unpacking procedures, and methods for reserving unused sockets for future use. This manual is written in Chinese.
| Pin count | 223 Positions |
|---|---|
| Socket envelope | 50.34mm x 21.94mm x 2.24mm |
| Dim H after soldering | 2.235 ± 0.127 mm |
| Solder ball coplanarity | 0.20 mm max |
| Recommended peak temperature | 230~250 °C |
| Slope | < 3 °C/sec |
| Soak time | 60‑90 sec |
| Time above liquidus | 40‑120 sec |
| Stencil thickness | 0.14~0.15 mm |
| Stencil diameter | 0.55~0.65 mm |
Place the box with the Foxconn logo facing the right direction, cut open the box with a knife, remove the packing foams, hold the sockets with both hands and lift them onto a table.