Technical specifications and dimensions for the Foxconn BGA 350 socket.
The Foxconn BGA 350 socket is a vertical, surface‑mount type socket designed for 350‑pin BGA packages. It features a 1.27 mm pitch and is constructed with a thermoplastic base and stainless‑steel components.
The socket provides a mechanical durability of 30 cycles, a retention force of 65 g per pin, and an electrical contact resistance of up to 35 mΩ. It can withstand a dielectric voltage of 500 V, has an insulation resistance of at least 800 MΩ, and operates from 0 °C to +105 °C.
| Pitch | 1.27 mm |
|---|---|
| Number of Positions | 350 |
| Mechanical Durability | 30 cycles (min) |
| Socket Retention Force | 65 g per pin (min) |
| Electrical Contact Resistance | 35 mΩ max |
| Dielectric Withstanding Voltage | 500 V |
| Insulation Resistance | 800 MΩ min |
| Operating Temperature | 0 °C to +105 °C |
The socket has a 1.27 mm pitch.
It provides 350 positions.
The socket can operate from 0 °C up to +105 °C.