MAX7365 is an I2C-interfaced 8×7 key switch controller with GPIO ports. It provides microprocessors with management of up to 56 key switches. Keys codes generated for each keypress and release enable easier implementation of multiple key entries. Key inputs monitored statically, not dynamically, ensure low-EMI operation. The switches can be metallic or resistive (carbon) with up to 5kΩ of resistance. The device features autosleep and autowake to further minimize the power consumption of the device. The autosleep feature puts the device in a low-power state (1µA typical) after a programmable sleep timeout period. The autowake feature configures the device to return to normal operating mode from sleep upon a keypress. The key controller debounces and maintains a FIFO of key-press and release events (including autorepeat, if enabled). An interrupt (INT) output can be configured to alert key-presses either as they occur or at the maximum rate. Unused key switches can be used as GPI. In addition, there are five additional general-purpose input/output (GPIO) ports. GPOs can be programmed as push-pull or open-drain to high.
The MAX7365 is a microprocessor‑peripheral that monitors up to 56 key switches and provides five additional GPIO ports. It features a 16‑byte FIFO for key events, programmable key‑debounce times, and optional auto‑repeat. The device includes autosleep and autowake functions to minimize power consumption, and it can operate from 1.62 V to 3.6 V.
The part is offered in a compact 2 mm × 2 mm 25‑bump wafer‑level package (WLP) suitable for portable consumer electronics. Electrical characteristics such as supply current, key‑switch source voltage, and I²C timing are defined in the datasheet, along with a full register map for configuration and interrupt handling.
| Operating Supply Voltage (Vpp) | 1.62 V to 3.6 V |
|---|---|
| Key‑Switch Source Voltage (VKEY) | 0.42 V to 0.55 V |
| Key‑Switch Resistance (RKey) | 5 kΩ |
| Keyscan Frequency (fkey) | 51 kHz to 82 kHz |
| GPIO Input High Voltage | 0.7 × Vpp |
It is offered in a 2 mm × 2 mm 25‑bump wafer‑level package (WLP).