This technical note introduces Philips Magnetic Products' SMD coil formers and cores products, including E5.3/2.7/2, E6.3/2.9/2, EFD10, EFD12, EFD15, EFD20, EP7, ER9.5, ER11, RM4/I, RM5/I, RM6S/I, RM6S/ILP etc., and their features and characteristics.
Philips Magnetic Products introduces a new range of surface‑mount coil formers and cores that solve the coplanarity and solder‑spillage problems of traditional gull‑wing designs. The U‑pin termination embeds thicker pins in the plastic body, providing rigid solder pads with guaranteed coplanarity of less than 0.1 mm and separating winding tension from the pads.
The coil former bodies are made of high‑grade liquid‑crystal polymer (LCP) that tolerates soldering temperatures up to 350 °C and operating temperatures up to 180 °C. Materials for the solder pads, clips, and covers are specified, and a comprehensive list of models (E5.3/2.7/2, E6.3/2.9/2, EFD10, etc.) is provided with their electrical and mechanical parameters.
| Maximum operating temperature | 155 °C, IEC 85 class F |
|---|---|
| Coil former material | Liquid crystal polymer (LCP), glass reinforced, UL94V‑0 |
| Solder pad material | Copper‑tin alloy (CuSn) plated with tin‑lead (SnPb) |
| Clip material | Stainless (CrNi) steel |
| Clamping force | ~5 N |
The coil former can withstand soldering temperatures up to 350 °C for 3.5 seconds.
The body is made of high‑grade liquid‑crystal polymer (LCP) that offers excellent thermal stability.
The clip provides a clamping force of approximately 5 N.