ON Semiconductor MBRM130L Schottky Power Rectifier Datasheet

This document describes the features and characteristics of the MBRM130L Surface Mount Schottky Power Rectifier POWERMITE® Power Surface Mount Package. It utilizes the Schottky Barrier principle and has an optimized forward voltage drop and reverse current tradeoff. The advanced packaging techniques make it a highly efficient micro miniature, space-saving surface mount Rectifier. With its unique heatsink design, the Powermite® has the same thermal performance as the SMA while being 50% smaller in footprint area, and delivering one of the lowest height profiles, < 1.1 mm in the industry. Because of its small size, it is ideal for use in portable and battery-powered products such as cellular and cordless phones, chargers, notebook computers, printers, PDAs, and PCMCIA cards. Typical applications are AC-DC and DC-DC converters, reverse battery protection, and “ORing” of multiple supply voltages and any other application where performance and size are critical.


ON Semiconductor MBRM130L Schottky Power Rectifier Datasheet - cover page
Brand
ON Semiconductor
Category
Other Electronics
Document type
Datasheet
Language
English
Pages
5
File format
PDF
File size
64 KB
Published
02 May, 2012
Updated
28 September, 2023
MD5 checksum
597D00BA306C6F9AB18F77CF39DAFBFF

About this manual

The MBRM130L PowerMite® Schottky rectifier uses a barrier metal and epitaxial construction to achieve a low forward voltage drop and high efficiency in a compact surface‑mount package. Its 1.1 mm maximum height and 8.45 mm² footprint make it suitable for portable devices such as phones, chargers, and notebook computers.

Key electrical ratings include a peak repetitive reverse voltage of 30 V, an average rectified forward current of 1 A, and a peak repetitive forward current of 2 A. Thermal resistance values are 35 °C/W (junction‑to‑lead) and 23 °C/W (junction‑to‑tab), with a maximum junction temperature of 125 °C. The package weighs 16.3 mg and can be soldered up to 260 °C for 10 seconds.

What's inside

  • Features
  • Maximum Ratings
  • Thermal Characteristics
  • Electrical Characteristics
  • Mechanical Characteristics
  • Package Dimensions
  • Ordering Information

Specifications

Peak Repetitive Forward Current2.0 A
Peak Repetitive Reverse Voltage30 V
Maximum Height1.1 mm
Footprint Area8.45 mm²
Weight16.3 mg
Lead Soldering Temperature260 °C max for 10 s

Frequently asked questions

What is the maximum reverse voltage rating of the MBRM130L?

The device is rated for a peak repetitive reverse voltage of 30 V.

How tall is the PowerMite package?

The PowerMite package has a maximum height of 1.1 mm.

Are Pb‑Free versions of the MBRM130L available?

Yes, Pb‑Free packages are available for this device.

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