Lamina is the market leader in the development and manufacture of super-bright LED arrays, bringing solid-state lighting to applications that until now were only possible with traditional light sources. Lamina's LED arrays are manufactured by combining high brightness LEDs from industry-leading LED manufacturers with Lamina's proprietary LTCC-M multi-layer metal low temperature co-fired ceramic packaging technology. LTCC-M is a breakthrough in thermal performance for LED packaging technology, a key factor in determining LED life and reliability. Lamina's unmatched thermal performance coupled with package interconnectivity allows it to densely cluster multiple LEDs to achieve exceptionally high luminous intensity in very small footprints. Lamina's arrays are available in white, RGB and monochrome, from 1W to 100W, and also are available in custom packages. Lamina BL-2000 white LED arrays are configured with seven cavities, each populated with multiple LEDs.
This handbook describes the Lamina BL-2000 white LED light engine, a high‑brightness LED array built with Lamina's proprietary LTCC‑M packaging. It outlines typical applications such as general illumination, task lighting, automotive interior, and machine vision, and provides contact information for engineering support.
Technical data, mechanical dimensions, and recommended assembly procedures are included. The document covers electrical connections, heat‑sink requirements, optical recommendations, thermal performance, ESD protection, and handling precautions to ensure reliable operation and long LED life.
| Color Temperature (CCT) | 4000‑10000 K |
|---|---|
| Forward Voltage | 11.3 V |
| Test Current | 0.42 A |
| Power | 2.47 W |
| Luminous Flux | 73‑108 lm |
| Thermal Resistance | 2.63‑3.5 °C/W |
| Mounting Hole | 4× for 2‑56 screw |
The BL-2000 LED array is designed for a forward voltage of 11.3 V.
Mount the array using conductive epoxy or screw it down with thermal grease; thermal tape can be used but will increase thermal resistance.
The LED array must be operated at or below 125 °C.
Handle the arrays from the sides, avoid contact with the silicone encapsulant, and use ESD protection precautions.