Teridian 73M1922 Demo Board User Manual

This document is the Simplifying System IntegrationTM 73M1922 Demo Board User Manual published by Teridian Semiconductor Corporation, which describes the features and characteristics of the product.


Teridian 73M1922 Demo Board User Manual - cover page
Brand
Teridian
Category
Other device
Document type
User Manual
Language
English
Pages
15
File format
PDF
File size
242 KB
Published
11 April, 2012
Updated
28 September, 2023
MD5 checksum
049CA41E08E388E85CB208436386392A

About this manual

The Teridian 73M1922 Demo Board User Manual provides detailed information on the demo board that integrates the 73M1922 MicroDAA chipset. The board combines a Host Interface Chip (73M1902) and a Line Interface Chip (73M1912) to deliver modem codec functions, caller ID, ring detection, and other DAA features for PSTN connections.

The manual includes package contents, safety and ESD notes, connector descriptions, schematics, PCB layouts, bill of materials, pin definitions, related documentation, and contact information for support.

What's inside

  • Introduction
  • Package Contents
  • Safety and ESD Notes
  • Demo Board Options
  • Connectors
  • Demo Board Schematics, PCB Layouts and Bill Of Materials
  • Pin Descriptions
  • Related Documentation
  • Contact Information

Specifications

Maximum data rateV.92
Package types20‑pin TSSOP or 32‑pin QFN
Integrated functionsDAA, analog front‑end, CID, ring detection, tip/ring polarity reversal, on/off‑hook control, pulse dialing, loop current regulation
Power supply voltage3.3 V

Frequently asked questions

How is data transferred between the HIC and LIC chips?

All data and control information between the LIC and the HIC is transferred across a low‑cost pulse‑transformer barrier.

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