The Z-PACK TinMan connector family is a cost-effective solution for customers searching for a high density, high performance back-plane interconnect system.
The Z‑PACK TinMan High Speed connector family offers high‑density, high‑performance backplane interconnects for server, storage, switch and router applications. It features right‑angle receptacles, modular column versions, and reliable redundant contact designs that meet Bellcore/Telcordia requirements.
Technical data include up to 10 Gbps performance, 100 Ω differential impedance, RoHS compliance, and detailed mechanical dimensions for 3‑, 4‑ and 5‑pair assemblies. The catalog also lists part numbers, tooling information, and global technical‑support contacts.
| Maximum Data Rate | 10+ Gbps |
|---|---|
| Differential Impedance | 100 Ω ±10 % |
| Temperature Range | -65 °C to +90 °C |
| Current Rating per Contact | 0.5 A @ <30 °C |
| Dielectric Withstanding Voltage | 560 VAC |
| Maximum Operating Voltage | 250 VAC |
| Insertion Loss (10 GHz) | -2 dB |
| Crosstalk (50 ps) | 2.1 % |
It operates from –65 °C up to +90 °C.
Yes, the connector is RoHS compliant.
The connector supports data rates of 10 Gbps or higher.
Each contact can carry up to 0.5 A at temperatures below 30 °C.