TS-0675-09 is the specification sheet for 3M Electronic Test & Burn-In PGA Kit Sockets Pin Grid Arrays 10.
The Test & Burn-In PGA Kit offers a range of pin grid array (PGA) test sockets from 10 × 10 up to 25 × 25 matrices. The kit is intended for burn‑in and functional testing, with optional contact plating and a removable top plate to suit specific pin patterns.
The document lists physical, electrical, environmental and mechanical characteristics, as well as part numbers for each matrix size and ordering details. It also includes durability data for room‑temperature and high‑temperature operation.
| Plating Options | Gold over Nickel (0.76 µm Au over 1.3 µm Ni) |
|---|---|
| Insulation Resistance | >1 × 10⁹ Ω at 500 Vdc |
| Withstanding Voltage | 1000 Vrms at Sea Level |
| Operating Temperature Range | -55 °C to +150 °C |
| Mechanical Life (Room Temp) | 25,000 actuations |
| Mechanical Life (150 °C) | Average four years |
It can operate from –55 °C up to +150 °C.
At 24 °C the socket is rated for about 25,000 actuations.
Contacts can be plated with 0.76 µm gold over 1.3 µm nickel.