3M™ Thermally Conductive Interface Pads 5595 and 5595S are designed to provide a preferential heat-transfer path between heat-generating components and heat sinks, heat spreaders or other cooling devices.
The 3M™ Thermally Conductive Interface Pads 5595 and 5595S provide a preferential heat‑transfer path between heat‑generating components and cooling devices such as heat sinks, heat spreaders or fans. The pads are made of a filled silicone polymer with a permanent 9 µm PEN film on the 5595S version for a non‑tacky surface and increased puncture resistance.
Application guidelines recommend cleaning substrates with isopropyl alcohol, applying the pad at a modest angle using a squeegee or roller, and compressing the parts to ensure good wetting and minimal air entrapment. The document also includes typical physical properties, safety certifications and warranty information.
| Thermal Conductivity | 1.6 W/m‑K |
|---|---|
| Operating Temperature Range | -60 °C to 125 °C |
| Pad Thickness | 0.5 mm, 1.0 mm, 1.5 mm, 2.0 mm ( >2 mm available on request ) |
| Primary Filler Type | Ceramic |
| Hardness (Shore 00) | 50‑60 Shore 00 |
| Dielectric Breakdown | 400 V/mil AC (tested on 5595S) |
| Volume Resistivity | 5 × 10^? Ω·cm (tested on 5595S) |
| Flammability Rating | UL‑94‑V0 |
Clean the substrate with isopropyl alcohol applied using a lint‑free wipe or swab; avoid denatured alcohol or glass cleaners.
The thermal conductivity is 1.6 W/m‑K.
They are rated for -60 °C to 125 °C.