This document describes the features and characteristics of the 5419 Low Static Polyimide Film Tape. The tape is a translucent polyimide film backed with silicone adhesive, designed for gold edge protection during wave soldering of printed circuit boards. It has extremely low electrostatic discharge properties and can withstand high temperatures. The tape has good adhesion to stainless steel and high tensile strength.
The 3M 5419 Low Static Polyimide Film Tape is a translucent polyimide film backed with silicone adhesive that offers extremely low electrostatic discharge, making it suitable for gold‑edge protection during wave soldering of printed circuit boards. It is designed to minimize static charge buildup both when unwound and when removed from a PCB.
The sheet lists physical properties such as a 70 µm film thickness, 30 µm backing thickness, and gold colour, along with performance data including adhesion, tensile strength, temperature range, dielectric strength and insulation resistance. Application guidance recommends clean, dry, non‑dusty surfaces above 0 °C and firm, even pressure for optimal adhesion.
| Adhesive Type | Silicone |
|---|---|
| Backing | Polyimide |
| Film Thickness (ASTM D‑3652) | 70 µm |
| Backing Thickness | 30 µm |
| Tape Colour | Gold |
| Shelf Life | 12 months from date of despatch |
| Adhesion to Stainless Steel (ASTM p‑3330) | 2.2 N/10 mm |
| Tensile Strength (ASTM D‑3759) | 577.8 N/10 mm |
| Elongation at Break | 60 % |
| Maximum Temperature | 260 °C |
| Minimum Temperature | -73 °C |
| Dielectric Strength | 7000 V |
| Insulation Resistance | >1×10⁰ Ω |
Removal from the roll is less than 150 V and removal from a PCB is less than 50 V.
Apply to a clean, dry, non‑dusty surface above 0 °C and use firm, even pressure to improve adhesion.
The tape can be used from a minimum of –73 °C up to a maximum of 260 °C.