Intersil HM-6642/883 CMOS PROM Datasheet

HM-6642/883 512 x 8 CMOS PROM is a 512 x 8 CMOS NiCr fusible link Programmable Read Only Memory produced by Intersil, which has synchronous circuit design techniques and CMOS processing techniques, and has high speed performance and very low power consumption.


Intersil HM-6642/883 CMOS PROM Datasheet - cover page
Brand
Intersil
Category
Other Electronics
Document type
Datasheet
Language
English
Pages
9
File format
PDF
File size
331 KB
Published
27 March, 2012
Updated
30 September, 2023
Model
HM-883
MD5 checksum
C47335743EB8BC98E381225197A73194

About this manual

The HM-6642/883 is a 512 × 8 CMOS programmable read‑only memory offered in a 24‑pin package. It features low standby power, fast access times, on‑chip address latches, and separate output enable control, making it suitable for microprocessor‑based instrumentation and communication systems.

The document lists detailed electrical performance data, absolute maximum ratings, package dimensions for both SBDIP and CLCC formats, and handling precautions such as ESD sensitivity. It also includes functional diagrams and test load circuits for verification.

What's inside

  • Features
  • Pin Description
  • Functional Diagram
  • Absolute Maximum Ratings
  • Electrical Performance Specifications
  • Package Information
  • Die Characteristics
  • Conformance and Test

Specifications

Memory Size512 × 8 bits
Supply VoltageSingle 5.0 V
Operating Temperature Range-55 °C to +125 °C
Access Time120 ns typical, 200 ns max
Input Low Voltage-0.3 V to +0.8 V
Input High Voltage2.2 V to 2.4 V (VCC+0.3 V)
Package TypesSBDIP and CLCC

Frequently asked questions

What supply voltage does the HM-6642/883 require?

It operates from a single 5.0 V supply.

What is the typical access time of the HM-6642/883?

Typical access time is 120 ns, with a maximum of 200 ns.

What temperature range can the device operate in?

The device is rated for operation from –55 °C to +125 °C.

Which package options are available for the HM-6642/883?

It is offered in Ceramic Dual‑in‑Line Metal Seal (SBDIP) and Ceramic Leadless Chip Carrier (CLCC) packages.

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