This application note provides guidelines for mounting heat sinks to power semiconductor packages, covering thermal resistance models, interface materials…
This document outlines the thermal management principles for mounting heat sinks to power semiconductor devices. It explains the thermal resistance model, which includes junction-to-case, case-to-heat sink, heat sink, and heat sink-to-ambient resistances. A key focus is minimizing contact thermal resistance caused by air gaps between the package and the heat sink surface.
| Recommended mounting torque for TO220 | 4 kgf cm to 6 kgf cm |
|---|---|
| Recommended mounting torque for TO3P, TO247, TO264 | around 9 kgf cm |
| Recommended mounting torque for TO220 (alternative) | 6 kgf cm to 8 kgf cm |
It can be reduced by increasing the contact pressure (mounting torque) or by filling the air gap with an interface material like silicone grease.
Clip mounting and rivet mounting are popular for mass production because they are simple and reliable, though rivet mounting is difficult to disassemble.