This Intel datasheet addendum provides timing specifications, electrical and thermal characteristics for the 82371SB (PIIX3) PCI‑ISA IDE Xcelerator.
The document supplies detailed timing diagrams, electrical characteristics, and thermal data for the 82371SB (PIIX3) PCI‑ISA IDE Xcelerator, a multi‑function bridge and IDE controller used in Intel 430HX, 82430HX and 82430VX PCIsets. It is intended for designers needing precise timing and electrical parameters when integrating the device.
Key sections include an introduction, absolute maximum ratings, thermal characteristics, DC and AC specifications, numerous timing diagrams (PCI, IDE, USB, IOAPIC), and timing relationship diagrams such as PCI‑to‑IDE transaction timing and command strobe widths.
| Case Temperature Range | 0°C to +85°C |
|---|---|
| Storage Temperature Range | -55°C to +150°C |
| Voltage on Any Pin (relative to ground) | -0.3 V to VCC + 0.3 V |
| Supply Voltage (relative to VSS) | -0.3 V to +6.5 V |
| Maximum Power Dissipation | 1.0 W |
| Package Thermal Resistance (θja) | 34.5 °C/W |
| Package Thermal Resistance (θjc) | 12.0 °C/W |
| Input Low Voltage (VIL1) | -0.3 V to 0.8 V |
| Input High Voltage (VIH1) | 2.0 V to VCC/VCC3 + 0.3 V |
| Output Low Voltage (VOL1) | 0.4 V |
| Output High Voltage (VOH1) | VCC/VCC3 - 0.5 V |
The device is rated for a case temperature of 0 °C to +85 °C and a storage temperature of –55 °C to +150 °C.
The device is compliant with PCI Specification Revision 2.1.