EMIF06-SD02F3 is a highly integrated device, based on IPAD technology, combining 5 functions. The Flip-Chip packaging means the package size is equal to the die size. It is compliant with IEC 61000-4-2, HBM IEC 61340-3-1 standards, and can be used in mobile phones, communication systems etc.
The EMIF06-SD02F3 is a Flip-Chip packaged component designed to protect removable memory cards in mobile phones and communication systems. It integrates five main functions: ESD protection compliant with IEC standards up to 15 kV on external pins, low-pass filtering for EMI reduction, level translation between host and card voltages, signal conditioning, and an integrated low-dropout voltage regulator.
| ESD protection (external pins, air discharge) | 15 kV |
|---|---|
| ESD protection (external pins, contact discharge) | 8 kV |
| Maximum junction temperature | 150 °C |
| Power supply voltage (Vcca) | 1.8 V |
| Battery power supply voltage (Vbat) | 3-5 V |
The device uses a Flip Chip package with 24 bumps.
The maximum junction temperature is 150 °C.
The maximum power dissipation is 1 W.