Fairchild Semiconductor TinyBuck Assembly Guidelines Application Note

Introduces the assembly guidelines for Fairchild TinyBuck™ packaging

Brand: Fairchild
Category: Other Electronics
Document type: Application Note
Language: English
Pages: 6
File format: PDF
File size: 654 KB
Published: 12 July, 2012
Updated: 29 September, 2023
MD5 checksum: 042A7F34600C469CEE64A2A574021D42
PDF: Fairchild Semiconductor TinyBuck Assembly Guidelines Application Note PDF

About this manual

This document outlines assembly guidelines for the Fairchild TinyBuck package, which utilizes Molded Leadless Packaging (MLP) technology. It focuses on soldering and back-end processing to ensure reliable assembly and optimal thermal performance. Key considerations include PWB design, pad finishes, and the use of vias.

What's inside

Introduction
Board Mounting
PWB Design Considerations
Pad Finish
PWB Material
Using Vias with TinyBuck
Stencil Design
Solder Paste
Reflow Profile
Voiding

Specifications

Peak Reflow Temperature	260°C
Recommended Solder Paste Alloy	SAC 305
Recommended Stencil Thickness	4 mil
Recommended Stencil Aperture Coverage	70%
Acceptable Stencil Aperture Coverage Range	50-80%
Recommended Via Drill Size	0.3mm
Maximum Recommended Voiding	25%

Frequently asked questions

What is the recommended solder paste alloy for the TinyBuck package?

The recommended lead-free solder paste alloy is SAC 305 (96.5 Sn/3.0Au/0.5Cu).

What is the maximum recommended voiding percentage for TinyBuck packages?

Fairchild recommends a guideline of 25% voiding for TinyBuck packages.

What is the peak reflow temperature rating for the TinyBuck package?

The TinyBuck package is rated for a peak reflow temperature of 260°C.

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