MACOM offers a broad family of silicon PIN diode chips covering low‑capacitance, high‑speed, and high‑voltage applications. The chips are available in various packages, including hermetically sealed CERMACHIP glass and silicon‑dioxide passivated mesa structures, with voltage ratings from 50 V up to 1 500 V.
The document includes detailed electrical specifications, maximum ratings, and recommended bonding and handling procedures. Chips should be stored in a dry, clean environment and handled with a vacuum pencil. Hot‑gas bonding with gold‑tin preforms is recommended for small CERMACHIP devices, while lead‑tin‑silver solder is advised for larger packages.
| Maximum reverse voltage (MA4P150) | 20 V |
|---|---|
| Capacitance at 1 MHz (MA4P151) | 0.05 pF |
| Maximum reverse voltage (MA4P160) | 100 V |
No, flux should not be used with CERMACHIP diodes because it damages the passivation surface.