The MAX9879 combines a high-efficiency stereo Class D audio power amplifier with a stereo capacitor-less DirectDrive® headphone amplifier. It provides Class AB performance with Class D efficiency, delivering up to 715mW of power into an 8Ω load with 88% efficiency from a 3.7V supply, extending battery life. The filterless modulation scheme, active emission limiting circuitry, and spread-spectrum modulation reduce EMI and eliminate the need for output filtering. The headphone amplifier delivers up to 58mW into a 16Ω load from a 3.7V supply. The device features a ground-referenced output, eliminating the need for large DC-blocking capacitors. It also includes a user-defined input architecture, preamplifier gain settings, input mixer, volume control, click-and-pop suppression, and I2C control. The bypass mode allows an external amplifier to drive the speaker connected to the MAX9879 outputs. The MAX9879 is available in a thermally efficient, space-saving 30-bump UCSP™ package.
The MAX9879 combines a high‑efficiency stereo Class D power amplifier with a capacitor‑less DirectDrive® headphone amplifier. It delivers up to 715 mW speaker output and 58 mW headphone output from a 3.7 V supply, offering Class AB performance with Class D efficiency.
Key features include a user‑defined input architecture, three pre‑amplifier gain settings, click‑and‑pop suppression, hardware/software shutdown modes, and a space‑saving 30‑bump UCSP package. The document provides absolute maximum ratings, detailed electrical characteristics, typical operating curves, and a reference application circuit.
| Speaker Output Power | 715 mW |
|---|---|
| Headphone Output Power | 58 mW |
| Efficiency | 88 % |
| Speaker THD+N (1 kHz) | 0.04 % |
| Headphone THD+N (1 kHz) | 0.018 % |
| Supply Voltage Range | 2.7 V to 5.5 V |
| Current Limit | 1.5 A |
| Package Type | 30‑bump UCSP (5 × 6) array |
The MAX9879 can deliver up to 715 mW into an 8 Ω load.
The amplifier operates at 88 % efficiency.
It operates from 2.7 V to 5.5 V.
The device is available in a 30‑bump UCSP package (5 × 6 array).