This is a user's manual for CSP products. It mainly introduces the structure and characteristics of CSP, general handling methods, possible defect modes in the mounting process, and visual inspection standards.
The manual describes the characteristics of Chip Scale Packages (CSP) and outlines the recommended one‑by‑one handling procedures to avoid damage during transport, storage, and PCB assembly. It includes detailed instructions for box, tray, and reel conveyance, as well as guidelines for mounting processes and memory module handling.
Additional sections cover common failure modes such as chip cracks, solder joint reliability, and reball repair, and provide visual inspection criteria for marking areas, solder balls, and external surfaces to ensure product quality.
| Chip break force (kgf) | 4.30 |
|---|---|
| Package break force (kgf) | 4.85 |
| Solder ball coplanarity limit | 4 Mil |
The manual recommends one‑by‑one handling with no manual handling, using vacuum pads and following the specific box, tray, and reel procedures.
Solder balls must not be missing, fused, mis‑placed beyond tolerance, or damaged; any such defect requires rejection.