3M™ Thermally Conductive Grease TCG-2037 / TCG-2033 is a high performance thermal interface material for transferring thermal energy from a heat source (e.g.: processor chip, graphics chip, etc.) to a heat sinking or heat spreading surface. It is made of inorganic fillers in a non-silicone resin system, providing for excellent bulk thermal conductivity along with very low thermal resistance.
The 3M Thermally Conductive Grease TCG-2037 and TCG-2033 are high‑performance thermal interface materials designed to transfer heat from components such as processors or graphics chips to heat sinks. TCG-2037 offers superior bulk conductivity with a non‑silicone resin system, while TCG-2033 has lower viscosity for thinner bond lines and is screen‑printable.
The sheet provides typical physical and performance characteristics, storage and shelf‑life guidance, and detailed directions for application, including recommended pressure, temperature, and mixing procedures. Safety and warranty information are also included.
| Thermal conductivity (k) | 3.0 W/m‑K |
|---|---|
| Thermal impedance | 0.017 C‑in²/W |
| Dielectric breakdown strength | 105 V/mm |