This document introduces the characteristics of the 8898 series products.
The 3M 5595 and 5595S thermally conductive interface pads are silicone‑based pads designed to provide a preferential heat‑transfer path between heat‑generating components and cooling devices such as heat sinks, heat spreaders, or fans. The 5595 version offers a soft silicone polymer base, while the 5595S includes a permanent 9 µm PEN film on one side for a non‑tacky surface and improved puncture resistance.
The document provides typical physical properties, performance characteristics, and detailed application guidelines, including surface preparation, pad placement, and assembly recommendations. Certification information, safety notices, and contact details for additional product support are also included.
| Thermal Conductivity | 1.6 W/m‑K |
|---|---|
| Operating Temperature Range | -60 °C to 125 °C |
| Dielectric Breakdown | 400 V/mil AC (5595S tested) |
| Volume Resistivity | 5 × 10⁹ Ω·cm (5595S tested) |
| Flammability Rating | UL‑94‑V0 |
Isopropyl alcohol applied with a lint‑free wipe or swab is recommended for removing surface contamination before applying the thermal pad.
Pad thicknesses of 0.5 mm, 1.0 mm, 1.5 mm, and 2.0 mm are standard; thicker than 2 mm can be obtained on inquiry.
The 5595 pad has a thermal conductivity of 1.6 W/m‑K measured at low pressure (<10 psi).
The pads are rated for operation from –60 °C up to 125 °C.