SDK-E3G-FANOUT-R1 is an evaluation/carrier board for the Enabler IIIG family of modules that allows for quick integration of the module via SMT pads connected to the 100-way Molex connector mounted on the PCB.
The SDK‑E3G‑FANOUT‑R1 is a low‑cost, RoHS‑compliant evaluation/carrier board designed for use with Enabler III modules. It features an integral SIM holder and a 100‑way Molex connector for quick module integration via SMT pads.
The handbook details the board’s dimensions, power requirements, and a range of interfaces including serial, GPIO, analog and digital audio, and RF options. It also provides a complete pin‑layout reference for the Molex connector and notes that the board ships populated except for the module and MMCX connector.
| Size | 50 x 50 mm |
|---|---|
| Operating voltage | 3.4V‑4.4V DC |
| Connector | 100‑way Molex 51338‑1074 board‑mounted connector |
| Serial interface | 9‑signal 1.8 V logic level serial interface |
| GPIO | GPIO 1‑8 including ADC |
The board measures 50 mm by 50 mm.
It operates from 3.4 V to 4.4 V DC.
The board uses a 100‑pin Molex connector.
A 9‑signal, 1.8 V logic level serial interface is available.