The HC5503PRC is a low-cost SLIC optimized for large Telecom switches. It combines a flexible voltage feed architecture with the Intersil latch-free DI bonded wafer process, to provide a low component count, carrier class solution at very low cost. The re-configurable design permits simple, economical solutions for campus-wide call center and PBX applications. External components can be used in conjunction with the high battery voltage capability to meet the complex impedance and long loop drive requirements of Central Office switches, worldwide.
The HC5503PRC is a subscriber line interface circuit (SLIC) designed for large telecom switches, campus‑wide call centers and PBX applications. It uses Intersil’s latch‑free DI bonded wafer process to provide a low component count and carrier‑class performance at a low cost.
Key features include a wide operating battery range of –40 V to –58 V, a 30 mA short‑loop current limit, on‑hook power reduction, loop‑power denial, thermal protection, and flexible 2‑wire and 4‑wire interfaces. The device is offered in 24‑lead SOIC and 32‑lead QFN packages and complies with Pb‑free manufacturing standards.
| Operating Battery Range | -40 V to -58 V |
|---|---|
| Short Loop Current Limit | 30 mA |
| Operating Temperature Range | 0 °C to 70 °C |
| Maximum Junction Temperature | 150 °C |
The device operates from –40 V to –58 V.
It can operate from 0 °C up to 70 °C.
The short‑loop current is limited to 30 mA.