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FEATURES
Metal-Semiconductor junction with guard ring
Epitaxial construction
Low forward voltage drop
High current capability
The plastic material carries UL recognition 94V-0
For use in low voltage,high frequency inverters,free wheeling,and polarity protection applications
FEATURES
Low cost
Diffused junction
Low forward voltage drop
Low reverse leakage current
High current capability
The plastic material carries UL recognition 94V-0
FEATURES
Metal-Semiconductor junction with guard ring
Epitaxial construction
Low forward voltage drop
High current capability
The plastic material carries UL recognition 94V-0
For use in low voltage,high frequency inverters,free
wheeling,and polarity protection applications
FEATURES
Metal-Semiconductor junction with guard ring
Epitaxial construction
Low forward voltage drop
High current capability
The plastic material carries UL recognition 94V-0
For use in low voltage,high frequency inverters,free
wheeling,and polarity protection applications
FEATURES
Metal-Semiconductor junction with guard ring
Low forward voltage drop
High current capability
The plastic material carries UL recognition 94V-0
For use in low voltage,high frequency inverters,free
wheeling,and polarity protection applications
FEATURES
Metal-Semiconductor junction with guard ring
Epitaxial construction
Low forward voltage drop
High current capability
The plastic material carries UL recognition 94V-0
For use in low voltage,high frequency inverters,free wheeling,and polarity protection applications
FEATURES
Rating to 1000V PRV
Ideal for printed circuit board
Reliable low cost construction utilizing molded plastic
technique
The plastic material has UL flammability classification
94V-0
In compliance with EU RoHS 2002/95/EC directives
FEATURES
Low cost
Diffused junction
Low forward voltage drop
Low reverse leakage current
High current capability
The plastic material carries UL recognition 94V-0
FEATURES
Metal-Semiconductor junction with guard ring
Low forward voltage drop
High current capability
The plastic material carries UL recognition 94V-0
For use in low voltage,high frequency inverters,free
wheeling,and polarity protection applications
The light-emitting diode of an LED package radiates light and heat according to the input power. However, the surface area of an LED package is quite small,and the package itself is expected to release little heat into the atmosphere.An external radiator such as a heat sink is thus required.The heat dissipation structure up to the connection portion of the external radiator uses mainly heat conduction.
The light-emitting diode of an LED package radiates light and heat according to the input power. However, the surface area of an LED package is quite small,and the package itself is expected to release little heat into the atmosphere.An external radiator such as a heat sink is thus required.The heat dissipation structure up to the connection portion of the external radiator uses mainly heat conduction.
The light-emitting diode of an LED package radiates light and heat according to the input power. However, the surface area of an LED package is quite small,and the package itself is expected to release little heat into the atmosphere.An external radiator such as a heat sink is thus required.The heat dissipation structure up to the connection portion of the external radiator uses mainly heat conduction.
The light-emitting diode of an LED package radiates light and heat according to the input power. However, the surface area of an LED package is quite small,and the package itself is expected to release little heat into the atmosphere.An external radiator such as a heat sink is thus required.The heat dissipation structure up to the connection portion of the external radiator uses mainly heat conduction.
The light-emitting diode of an LED package radiates light and heat according to the input power. However, the surface area of an LED package is quite small,and the package itself is expected to release little heat into the atmosphere.An external radiator such as a heat sink is thus required.The heat dissipation structure up to the connection portion of the external radiator uses mainly heat conduction.
The light-emitting diode of an LED package radiates light and heat according to the input power. However, the surface area of an LED package is quite small,and the package itself is expected to release little heat into the atmosphere.An external radiator such as a heat sink is thus required.The heat dissipation structure up to the connection portion of the external radiator uses mainly heat conduction.
