Industrial

The light-emitting diode of an LED package radiates light and heat according to the input power. However, the surface area of an LED package is quite small,and the package itself is expected to release little heat into the atmosphere.An external radiator such as a heat sink is thus required.The heat dissipation structure up to the connection portion of the external radiator uses mainly heat conduction.

The light-emitting diode of an LED package radiates light and heat according to the input power. However, the surface area of an LED package is quite small,and the package itself is expected to release little heat into the atmosphere.An external radiator such as a heat sink is thus required.The heat dissipation structure up to the connection portion of the external radiator uses mainly heat conduction.

The light-emitting diode of an LED package radiates light and heat according to the input power. However, the surface area of an LED package is quite small,and the package itself is expected to release little heat into the atmosphere.An external radiator such as a heat sink is thus required.The heat dissipation structure up to the connection portion of the external radiator uses mainly heat conduction.

The light-emitting diode of an LED package radiates light and heat according to the input power. However, the surface area of an LED package is quite small,and the package itself is expected to release little heat into the atmosphere.An external radiator such as a heat sink is thus required.The heat dissipation structure up to the connection portion of the external radiator uses mainly heat conduction.

The light-emitting diode of an LED package radiates light and heat according to the input power. However, the surface area of an LED package is quite small,and the package itself is expected to release little heat into the atmosphere.An external radiator such as a heat sink is thus required.The heat dissipation structure up to the connection portion of the external radiator uses mainly heat conduction.

FEATURES Fast switching for high efficiency Low cost Glass passivation junction Low reverse leakage current Low forward voltage drop High current capability The plastic material carries UL recognition 94V-0

FEATURES Fast switching for high efficiency Low cost Glass passivation junction Low reverse leakage current Low forward voltage drop High current capability The plastic material carries UL recognition 94V-0

FEATURES Fast switching for high efficiency Glass passivated chip Low reverse leakage current Low forward voltage drop High current capability Plastic material has UL flammability classification 94V-0

FEATURES Low cost Diffused junction Low forward voltage drop Low reverse leakage current High current capability The plastic material carries UL recognition 94V-0

FEATURES Low cost Diffused junction Low forward voltage drop Low reverse leakage current High current capability The plastic material carries UL recognition 94V-0

FEATURES Fast switching for high efficiency Low cost Glass passivation junction Low reverse leakage current Low forward voltage drop High current capability The plastic material carries UL recognition 94V-0

MECHANICAL DATA Case : JEDEC DO-41 molded plastic Polarity : Color band denotes cathode Weight : 0.012 ounces, 0.34 grams Mounting position : Any

FEATURES Fast switching for high efficiency Glass passivated chip Low reverse leakage current Low forward voltage drop High current capability Plastic material has UL flammability classification 94V-0

FEATURES Diffused junction Low forward voltage drop Low reverse leakage current High current capability EXceeds environmental standards of MIL-S-195000/228

FEATURES Low cost Diffused junction Low forward voltage drop Low reverse leakage current High current capability The plastic material carries UL recognition 94V-0