Appendix of the Philips RF Manual covering thermal design for SMD discretes, RF basics and design fundamentals.
This appendix of the Philips RF Manual 7th Edition provides detailed thermal design considerations for surface‑mount device (SMD) discretes, including definitions, heat‑sinking methods, and example calculations for JFET families. It also includes sections on RF application basics, frequency spectrum, antenna functions, and fundamental RF design concepts.
The document contains thermal resistance formulas, example derating diagrams for devices such as PMBFJ620, and reference tables for junction temperature limits and power dissipation. It concludes with a list of references to Philips Semiconductors datasheets and application notes.
| Typical silicon junction temperature range | 150 °C to 175 °C |
|---|---|
| Thermal resistance (junction‑to‑solder, single loaded) | 315 K/W |
| Thermal resistance (junction‑to‑solder, double loaded) | 160 K/W |
| Maximum junction temperature | 150 °C |
The thermal resistance is about 315 K/W for a single‑loaded device.
The manual lists a maximum junction temperature of 150 °C for silicon devices.
Typical silicon junction temperatures are between 150 °C and 175 °C.