Thermal Bonding Compound is an essential thermal management product for electronic products. It is a metal oxide loaded two part epoxy bonding system with excellent thermal conductivity properties whilst being electrically insulating. It is an invaluable tool for use in the manufacture of heat sink assemblies in 'piggy back' heat sink arrangements; for the assembly of complex heat sinks thus effecting major cost savings. It is also ideal for use as a bonding medium in surface mounting assemblies. Electrolube offers a full range of heat transfer products. This range includes silicone and non-silicone pastes (HTS & HTC), a RTV rubber (TCR) and an epoxy based potting resin (ER2074). A even higher thermally conductive paste is also available, order code HTSP, for special applications where thermal management is critical.