LSM330 is a MEMS sensor module released by ST company, which contains a 3D digital accelerometer and a 3D digital gyroscope, and has 2 embedded programmable state machines, which can realize autonomous applications and motion activated functions.
The LSM330 is a system-in-package featuring a 3D digital accelerometer with two embedded state machines that can be programmed to implement autonomous applications and a 3D digital gyroscope. The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology.
The module offers selectable full-scale ranges for acceleration (±2 g to ±16 g) and angular rate (±250 to ±2000 dps). It includes an embedded temperature sensor, FIFO buffers, and supports SPI/I2C serial interfaces. The device is available in a plastic land grid array (LGA) package and is RoHS compliant.
| Analog supply voltage | 2.4 V to 3.6 V |
|---|---|
| Digital supply voltage IOs | 1.8 V |
| Acceleration full scale | ±2 g/±4 g/±6 g/±8 g/±16 g |
| Angular rate full scale | ±250/±500/±2000 dps |
| Package type | LGA-24L |
| Interface types | SPI/I2C |
The LSM330 is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope.
The analog supply voltage ranges from 2.4 V to 3.6 V.
The digital supply voltage for the IOs is 1.8 V.