STMicroelectronics VN772K Quad Smart Power Solid State Relay Datasheet

The VN772K is a quad smart power solid state relay for complete H-bridge configurations. It has features such as low voltage bridge, linear current limitation, very low standby power dissipation, short circuit protection, status flag diagnostic (open drain), integrated clamping circuits, undervoltage protection and ESD protection.


STMicroelectronics VN772K Quad Smart Power Solid State Relay Datasheet - cover page
Brand
STMicroelectronics
Category
Other Electronics
Document type
Datasheet
Language
English
Pages
33
File format
PDF
File size
853 KB
Published
08 August, 2012
Updated
01 October, 2023
Model
VN772K
MD5 checksum
ACC537581F1603AB1E0B92179C357BCF

About this manual

The VN772K is an integrated device formed by three monolithic chips housed in a standard SO-28 package. It combines two double high-side switches with two low-side switches to drive DC motors or function as a quad switch.

The dual high-side switches utilize viPower MO-3 Technology and feature built-in thermal shutdown, linear current limitation, and status output for diagnostics. The low-side switches are OMNIFET II types with fully auto-protected Power MOSFET technology, including overvoltage clamping and fault feedback capabilities.

What's inside

  • Block diagrams and pins descriptions
  • Electrical specifications
  • Thermal data
  • Absolute maximum ratings
  • Application recommendations

Specifications

Package typeSO-28
Total resistance of one side in bridge configuration120 mΩ
Maximum DC supply voltage (Vcc)4 V
Reverse DC output current limit-6 A

Frequently asked questions

What is the package type for the VN772K?

The device is housed in a standard SO-28 package.

Is the VN772K suitable for H-bridge configurations?

Yes, it is designed specifically for complete H-bridge configurations as well as low voltage applications.

What technology is used in the high-side switches?

The dual high side switches are made using STMicroelectronics viPower MO-3 Technology.

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