This is an application note about the semiconductor device manufacturing process.
This document provides an introduction to semiconductor technology, specifically focusing on the manufacturing processes used by STMicroelectronics. It explains the two major phases of integrated circuit production: wafer fabrication (front-end) and assembly (back-end).
The resolution limit for the minimal line size inside the circuit is 0.35 microns.
For microcontrollers, the typical wire thickness is 33 microns.