This document is EE-352 technical note, which introduces the soldering considerations for Analog Devices DSP and processor boards
This Engineer-to-Engineer Note (EE-352) discusses general soldering guidelines for Analog Devices Inc. (ADI) DSP and processor boards, as well as specific considerations for Exposed Pad (EPAD) packages. It emphasizes the importance of determining the correct temperature profile based on board thickness, component types, and solder paste characteristics to ensure electrical and thermal requirements are met.
The document addresses commonly asked questions regarding EPAD packages, such as the necessity of via holes under the heat-sink area, recommended paste thickness, stencil opening designs, and acceptable limits for solder voids. It also outlines techniques for preventing solder wicking into vias, such as via tenting, plugging, and encroachment.
No, the temperature profile is unique to the part, the board, and the characteristics of the solder paste used.
The total void area must be less than 50% of the EPAD, and no more than 50% of the vias to the GND plane should be in a void.
The largest single void should not exceed 30% of the EPAD area.