This PDF file introduces Analog Devices' mixed-signal processing and power conversion solutions for military and aerospace applications.
Analog Devices' Multichip Products Group acts as a design partner to help achieve higher performance, ruggedness, and density in mixed-signal designs. The group utilizes high density interconnect technology based on commercial off-the-shelf (COTS) silicon to reduce development risks and system-level costs. With access to a broad portfolio of mixed-signal silicon and 30 years of integration experience, the team optimizes electrical, thermal, and mechanical requirements for military and aerospace applications.
The group supports applications such as radar and IR seeker electronics for missiles, telecommunications satellite payload electronics, and avionics modules.
The group operates a distinguished QML manufacturing facility.
Available technologies include Co-Fired Ceramic, Thick Film, Thin Film, Laminate, and Leaded and BGA.