This document is a construction analysis report on the Analog Devices ADSP-21062-KS-160 SHARC Digital Signal Processor. The report describes the assembly and die process of the product, and lists some noteworthy issues and features.
The document presents a detailed construction analysis of the ADSP-21062-KS-160 SHARC digital signal processor. It describes the 240‑pin Plastic Quad Flat Package (PQFP), the copper heat slug, wirebonding method, die attach material, and the CMOS fabrication process used.
Results include observations on metal layer thickness, gate length, polysilicon layers, and the 2 Mbit SRAM array. The analysis notes no major defects, but highlights potential reliability concerns such as aluminum thinning in metal 2 vias and the presence of laser‑blown redundancy fuses.