TLP176GA is a photocoupler produced by TOSHIBA. It consists of an aluminum gallium arsenide infrared emitting diode optically coupled to a photo-MOSFET in a SOP, which is suitable for surface mount assembly. TLP176GA is suitable for modem applications which require space savings.
The TLP176GA is a gallium‑arsenide infrared emitting diode optically coupled to a photo‑MOSFET in a 4‑pin SOP package, intended for surface‑mount applications such as modems and other telecommunications equipment. It offers high isolation and low on‑state resistance in a compact form factor.
Key specifications include a peak off‑state voltage of 400 V, isolation voltage of 1500 Vrms, forward current rating of 50 mA, on‑state current up to 120 mA, and an on‑state resistance of 35 Ω. The device operates from –40 °C to 85 °C (recommended –20 °C to 65 °C) and can withstand soldering temperatures up to 260 °C. Usage restrictions and safety notes are also provided.
| Peak off‑state voltage | 400 V (min) |
|---|---|
| Isolation voltage | 1500 Vrms (min) |
| Forward current (IF) | 50 mA (max) |
| On‑state current | 120 mA (max) |
| Supply voltage (Vbpp) | 320 V (max) |
| Storage temperature range | -55 °C to 125 °C |
| Lead soldering temperature (10 s) | 260 °C |
The maximum forward current is 50 mA.
It provides an isolation voltage of at least 1500 Vrms.