DX Series High-Density I/O Connectors Datasheet


DX Series High-Density I/O Connectors Datasheet - cover page
Brand
DX
Category
Other Electronics
Document type
Datasheet
Language
English
Pages
35
File format
PDF
File size
1.5 MB
Published
05 May, 2012
Updated
30 September, 2023
MD5 checksum
355F9DB5A29BBA0878299C072220CC3E

About this manual

The DX series offers high‑density 1/0 I/O connectors with 1.27 mm (0.050 in) contact spacing, suitable for miniaturized electronic devices. Options include one‑touch and screw‑lock mechanisms, bellow contacts for smooth mating, and die‑cast zinc alloy shells for EMI shielding.

Connectors are available in multiple pin counts (20‑132 pins), various contact types (IDC, solder, right‑angle, straight dip, SMT, and coaxial), and support AWG #28 and #30 wires as well as ribbon cable formats. The datasheet provides detailed specifications, ordering codes, and accessory options.

What's inside

  • General
  • Features
  • Specifications
  • Applications
  • Ordering Information
  • Variations
  • Shell Types
  • Automatic Discrete Cable Combing Machine

Specifications

Current capacity0.54
Rated voltageAC125V
Insulation resistance250 MΩ or more at DC100V
Withstanding voltageAC300V rms for 1 min
Plug shell materialZinc alloy die‑cast, silver finish
Pin contact platingCopper alloy with selective gold plating
Socket contact platingCopper alloy with selective gold plating

Frequently asked questions

Which locking mechanisms are available for the DX connectors?

Both One‑Touch and Screw lock mechanisms are provided for quick and positive closures.

How many pins are offered in the DX series?

Pin counts of 20, 28, 36, 50, 60, 68, 80, 100 and 132 are available.

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