icminer.com Electronic-Library Service CopyRight 2003
This selection guide presents IC Sensors' Pressure Chips Series, a family of solid‑state pressure sensor chips designed for high‑volume OEM applications. Each chip is a fully active four‑arm Wheatstone bridge with a symmetrical layout that eliminates orientation requirements and offers large bonding pads for gold or aluminum wire bonding.
The guide lists standard pressure ranges from 0‑5 psi up to 0‑1000 psi, highlights key features such as excellent linearity, negligible hysteresis, and ratiometric output, and provides performance specifications, dimensional data, and ordering details for the various pressure‑type options (A, D, G, S).
| Full‑Scale Pressure | 300 mmHg |
|---|---|
| Excitation Voltage | 3‑10 V |
| Pressure Overload | up to 14× |
| Bridge Resistance Tolerance | +20 % |
| Bonding Pad Size | minimum 10 mil side, 1.2 µm thickness |
Available pressure types are A‑absolute, D‑differential (or G‑gage), and S‑sealed gage.