TOREX Manuals

This document introduces the power dissipation of SOT-223, including measurement conditions, and the relationship between power dissipation and ambient temperature.

This document provides packaging and layout information for SOT-223 package.

Introduce the power dissipation characteristics of SOP-8FD

This document provides power dissipation data for the SOP-8FD, including measurement results and thermal resistance data under different ambient conditions. Detailed information about the evaluation board and the relationship between power dissipation and ambient temperature is provided.

This document provides specific information about the SOT-23 package

This document mainly introduces taping specifications of SOT-89/89-5, SOT-89, SOP-8, SOT-8, and TO-92 models.

Introduces the power dissipation data for SOP-8

SOP-8 is a chip packaging form, and packaging information includes size information

This document provides packaging information and reference pattern layout dimensions of the product in SOD-723 package. The solder paste thickness of the product is 120 μm.

This document describes the dimensional specifications of a product, including diameter, length, width, etc. It also provides detailed specifications about the reel and tape.

This is a document about the specifications of the SOD-523 reel.

This document is the packaging dimensions information for SOD-523

SOD-323A packaging information, including dimensions and drawings

This document is the specification sheet of SOD-323A Reel

This is a PDF document that mainly introduces the specifications of SOD-123A Reel.