Technical note providing PCB, stencil and solder‑paste guidelines for surface‑mounting LGA‑package MEMS sensors.
This technical note (TN0018) gives general soldering recommendations for MEMS sensors that use an LGA surface‑mount package. It covers PCB layout rules, stencil design, solder‑paste application, processing considerations, and environmental specifications.
The guidance includes symmetric pad routing, avoidance of vias under the sensor, recommended stencil thickness (90‑150 µm), pad‑opening ratios (70‑90 %), solder‑paste volume limits (≤20 % of pad area), and reflow cooling rates (≤‑3 °C/s). Compliance with JEDEC J‑STD‑020 (MSL‑3) is also described. This manual is written in Chinese.