Standard operating procedure for the FLX 2320 stress measurement system, covering setup, single‑time and temperature scans, and data analysis.
The SOP describes the purpose and scope of the FLX 2320 Stress Measurement System, a thin‑film stress analysis instrument. It outlines the theoretical basis (Stoney’s equation) and provides the required material parameters for stress calculations.
Operational instructions cover single‑time scans, temperature scans, program loading, data processing, and graphing of results. Each procedure is broken into step‑by‑step actions, including sample placement, heater control, and data file handling.
| Elastic modulus (E/(1‑ν)) | 180.5 GPa |
|---|---|
| Film thickness (h) | 525 µm |
| Substrate thickness (t) | 7500 Å |
The SOP uses Stoney’s equation for stress calculation.
The required parameters are E/(1‑ν) = 180.5 GPa, film thickness h = 525 µm, substrate thickness t = 7500 Å, and biaxial modulus dν = 4.