The MicReD T3Ster thermal tester manual explains its non‑destructive measurement method, hardware setup, software operation and performance specifications.
The T3Ster thermal tester, developed by MicReD, provides a non‑destructive way to measure internal thermal resistance and capacitance of electronic components such as ICs, LEDs, heat sinks and heat pipes. It follows the JEDEC JESD51‑1 steady‑state real‑time method, changing the device power and recording transient temperature curves via the TSP sensor.
The system consists of a test host with power‑drive units and up to eight channels, a Windows‑based control and analysis software, and optional accessories like a static‑air test chamber and a temperature‑controlled box. The software captures transient data with up to 1 µs precision, offers a temperature resolution of 0.01 °C, and provides analysis tools such as structure‑function extraction and thermal‑resistance mapping. This manual is written in Chinese.
| Temperature resolution | 0.01 °C |
|---|---|
| Transient data acquisition precision | 1 µs |
It uses a non‑destructive steady‑state real‑time method based on JEDEC JESD51‑1, changing the device power and measuring transient temperature via the TSP sensor.
The instrument can resolve temperature changes as small as 0.01 °C.
Ten repeated measurements are performed and averaged for each condition to improve accuracy.