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- Last added
- 2026-09-29
Featured MicReD manuals

MicReD T3Ster Thermal Tester User Manual
The T3Ster thermal tester, developed by MicReD, provides a non‑destructive way to measure internal thermal resistance and capacitance of electronic components such as ICs, LEDs, heat sinks and heat pipes. It follows the JEDEC JESD51‑1 steady‑state real‑time method, changing the device power and recording transient temperature curves via the TSP sensor.
The system consists of a test host with power‑drive units and up to eight channels, a Windows‑based control and analysis software, and optional accessories like a static‑air test chamber and a temperature‑controlled box. The software captures transient data with up to 1 µs precision, offers a temperature resolution of 0.01 °C, and provides analysis tools such as structure‑function extraction and thermal‑resistance mapping. This manual is written in Chinese.
Covers: Abstract · Keywords · T3Ster Device Introduction · Working Principle · System Composition · Measurement Procedure
Latest MicReD manuals
MicReD T3Ster Thermal Tester User Manual
User Manual 6 pages · 424 KB · ZHThe MicReD T3Ster thermal tester manual explains its non‑destructive measurement method, hardware setup, software operation and performance specifications.
Which document do I need?
User Manual
Day-to-day operation, settings and troubleshooting. Start here if the product is already set up.
Questions answered in MicReD manuals
What measurement method does the T3Ster use?
It uses a non‑destructive steady‑state real‑time method based on JEDEC JESD51‑1, changing the device power and measuring transient temperature via the TSP sensor.
What is the temperature resolution of the T3Ster?
The instrument can resolve temperature changes as small as 0.01 °C.
