The Mesc Multiplex ICP Operator's Manual describes the manual loadlock HF inductively coupled plasma etch system, its components, and operating procedures.
The Multiplex ICP is a manual loadlock, HF inductively coupled plasma (ICP) etch system designed for research, development, and small‑scale production. It can process single 75 mm (3 in.) or 100 mm (4 in.) wafers and includes a combined ICP electronics unit, loadlock assembly, wafer loader, and process chamber with high‑density plasma generated at 13.56 MHz.
System control is provided by a standard PC running Windows, with a colour monitor that displays process information and allows recipe loading from hard or floppy disks. Safety is ensured by interlock displays, an emergency‑stop button, and multiple circuit breakers protecting power, RF, and pump supplies.
| Supported wafer size | 75 mm (3 in.) or 100 mm (4 in.) |
|---|---|
| Plasma frequency | 13.56 MHz |
| Control interface | Standard PC with Windows OS |
| Loadlock type | Manual loadlock with transparent hinged lid |
It can process single wafers of either 75 mm (3 in.) or 100 mm (4 in.) size.
The system is controlled by a standard PC running Windows, with a colour monitor that displays process information and allows recipe loading.