Indium WS-3543 Wafer Flux Product Leaflet

This document describes Indium WS-3543, a low-viscosity semiconductor-grade flux for wafers up to 300mm, suitable for SnPb and lead-free processes.


Indium WS-3543 Wafer Flux Product Leaflet - cover page
Brand
INDIUM
Category
Other Electronics
Document type
Product Leaflet
Language
Chinese
Pages
2
File format
PDF
File size
557 KB
Published
27 October, 2026
Updated
27 October, 2026
MD5 checksum
10935261AA481DF689CB0345EF7DF927

About this manual

Indium WS-3543 is a low-viscosity semiconductor-grade flux optimized to generate uniform, non-oxidized solder joints on wafers with a diameter not exceeding 300mm (12 inches). The formulation is designed to prevent tin starvation during the soldering process and allows for easy removal without residue after multiple application/reflow/cleaning cycles.

The flux is water-soluble and halogen-free, compatible with both SnPb and lead-free soldering processes. It can be applied using standard spray or spin-coating techniques. For spin coating, initial rotation speed is used to ensure uniform distribution, followed by speeds between 15rpm and 800rpm depending on the application. Spray application requires a supply sufficient for 8 hours, with the spray gun needing frequent cleaning to maintain purity. This manual is written in Chinese.

What's inside

  • Introduction
  • Features
  • Application Methods
  • Safety Data Sheet
  • Test Methods
  • Reflow Temperature Profile
  • Packaging
  • Cleaning
  • Storage
  • Technical Support

Frequently asked questions

What is the maximum diameter of wafers this flux is optimized for?

The flux is optimized for wafers with a diameter of up to 300mm (12 inches).

What is the recommended spin speed range for applying the flux?

The recommended spin speed range is from 15rpm to 800rpm.

What is the minimum water pressure required for ideal spray cleaning?

Ideal spray cleaning requires a pressure of over 60psi.

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