Data sheet for Indium 9.72-HF, a halogen-free chip bonding solder paste designed for low void rates and reliable dispensing.
The Indium 9.72-HF is a dispensable solder paste specifically engineered for chip bonding processes. It features extremely low void rates, excellent wetting properties, and no corrosion of wire bond pads. The product is halogen-free (no chloride or bromide) to meet environmental regulations and prevent pad corrosion. This manual is written in Chinese.
The flux contains no halides or halogens, meeting the definition of halogen-free according to IEC 61249-2-21.
It can be used with mixed atmospheres or nitrogen atmospheres where oxygen levels are below 100ppm.
The product should be stored below 10°C to extend its shelf life, which is 6 months under these conditions.