The HY-PULSE 900C is a standalone fluxless solder and eutectic bond station with high‑power pulse heating, Modbus control and optional microscope integration.
The HY‑PULSE 900C from HYBOND provides a high‑power pulse heat generator and dual temperature work stage for precise, rapid heating up to 500 °C. It supports Modbus communication, programmable heating/cooling profiles, and optional external triggers for integration with die bonders.
The station offers a range of optional accessories such as Nikon and Leica microscopes, fiber‑optic illuminators, and base plate assemblies. Detailed specifications include power requirements, package size limits, and throughput capabilities.
| Work Stage Temperature Range | Ambient to 500 °C |
|---|---|
| Maximum Package/Substrate Size | 840 mil × 980 mil (21 mm × 25 mm) |
| Input Power Requirements | 120 VAC standard or 240 VAC (with OP‑12) |
| Unit Weight / Shipping Weight | 35 lb (≈16 kg) |
| Approximate Units Per Hour (UPH) | 180–300 |
It can ramp from ambient to 400 °C in approximately 4 seconds.
The unit can be controlled via the Modbus protocol.