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- 2026-10-03
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HYBOND HY-PULSE 900C Fluxless Solder/Eutectic Bond Station Product Leaflet
The HY‑PULSE 900C from HYBOND provides a high‑power pulse heat generator and dual temperature work stage for precise, rapid heating up to 500 °C. It supports Modbus communication, programmable heating/cooling profiles, and optional external triggers for integration with die bonders.
The station offers a range of optional accessories such as Nikon and Leica microscopes, fiber‑optic illuminators, and base plate assemblies. Detailed specifications include power requirements, package size limits, and throughput capabilities.
Covers: Standard Features · Available Options · Specifications
Latest HYBOND manuals
HYBOND HY-PULSE 900C Fluxless Solder/Eutectic Bond Station Product Leaflet
Product Leaflet 2 pages · 1 MB · ENThe HY-PULSE 900C is a standalone fluxless solder and eutectic bond station with high‑power pulse heating, Modbus control and optional microscope integration.
Questions answered in HYBOND manuals
How quickly can the HY‑PULSE 900C reach 400 °C?
It can ramp from ambient to 400 °C in approximately 4 seconds.
From: HYBOND HY-PULSE 900C Fluxless Solder/Eutectic Bond Station Product Leaflet
Which communication protocol does the HY‑PULSE 900C support?
The unit can be controlled via the Modbus protocol.
From: HYBOND HY-PULSE 900C Fluxless Solder/Eutectic Bond Station Product Leaflet