The E‑Lins M300p 3G HSPA+ Modem specification sheet details its industrial‑grade features, interfaces, wireless standards, and physical dimensions.
The M300p 3G HSPA+ Modem is an industrial‑grade USB 2.0 modem designed for reliable data transmission in IoT, smart grid, transportation, and other M2M applications. It offers strong protection against moisture, rain, lightning, and electromagnetic interference, making it suitable for harsh environments.
Key specifications include support for GSM/EDGE/GPRS and 3G UMTS/HSPA+ networks, multiple SMA antenna connectors, IP30 metal housing, a wide operating temperature range, and low power consumption. The device measures 87 mm × 50 mm × 23 mm (without mounting holes) and weighs about 150 g. This manual is written in Chinese.
| Supported Networks | GSM EDGE/GPRS, 3G UMTS WCDMA (HSPA+, HSPA, HSUPA) |
|---|---|
| Maximum Downlink Speed | 21 Mbps (HSPA+ High) |
| USB Interface | USB 2.0 Mini‑B |
| Antenna Connectors | 3× SMA male (50 Ω), detachable |
| SIM/UIM Slot Voltage | 1.8 V / 3 V |
| Power Input | DC 5 V–40 V (optional DC 5 V–50 V), default DC 12 V 1 A or 2 A |
| Idle Power Consumption | <180 mA @12 V DC |
| Communication Power Consumption | <320 mA @12 V DC |
| Operating Temperature | -20 °C to 70 °C |
| Storage Temperature | -40 °C to 85 °C |
| Protection Rating | IP30 |
| Weight | ≈150 g (without accessories) |
It supports GSM EDGE/GPRS and 3G UMTS WCDMA networks, including HSPA+, HSPA, and HSUPA.
The modem can be powered from DC 5 V to 40 V (optionally up to 50 V), with a default configuration of DC 12 V at 1 A or 2 A.
It operates from –20 °C to 70 °C and can be stored from –40 °C to 85 °C.