Chipstar Audio Amplifier Compatibility Guide for Portable Devices

About this manual

The document explains how Chipstar Class‑AB and Class‑D audio amplifiers can be integrated into mobile devices. It lists the supported ICs (CS6190T, CS6105T, CS8120T, CS8115T, CS8110T) and presents a DFN 2×2_8L package layout that simplifies PCB design and re‑work.

Key features include the advantages of DFN packaging (better heat dissipation, easier transport and re‑soldering), Chipstar's AERC (Adaptive Edge Rate Control) technology for low‑EMI operation, and the AFS (Advanced Feedback System) that delivers high efficiency (>90%) and ultra‑low distortion (0.03%). The guide also provides demo‑board schematics and design tips such as differential routing and component placement. This manual is written in Chinese.

What's inside

• Chipstar Class‑AB and Class‑D Audio Amplifier Features
• DFN 2×2_8L Package Advantages
• Performance Comparison of CS8190T Series
• AERC Low‑EMI Technology
• AFS High‑Order Feedback System
• Compatible IC Layout and Demo Board
• Design Recommendations and Layout Tips

Specifications

Frequently asked questions

What is the advantage of the AFS feedback system in Chipstar's new Class‑D amplifiers?

AFS provides ultra‑low distortion (0.03 %) while maintaining high efficiency, delivering a more realistic sound experience.